Display device

ABSTRACT

A display device includes a display panel having a display area and a non-display area, signal wires disposed in the display area, connection wires disposed in the display area and electrically connected to the signal wires, and touch electrodes disposed on the connection wires. The connection wires include diagonal portions extending in a diagonal direction, and first protrusion patterns protruding from the diagonal portions of the connection wires. Parts of the first protrusion patterns overlap the touch electrodes.

CROSS REFERENCE TO RELATED APPLICATION(S)

This application claims priority to and benefits of Korean PatentApplication No. 10-2019-0113672 under 35 U.S.C. § 119, filed on Sep. 16,2019 in the Korean Intellectual Property Office, the entire contents ofwhich are incorporated herein by reference.

BACKGROUND 1. Technical Field

The disclosure relates to a display device.

2. Description of the Related Art

Importance of display devices has been increasing along with thedevelopment of multimedia. Various types of display devices, such asliquid crystal displays (LCDs) and organic light-emitting diode (OLED)displays, have been developed and are being in use. Among the varioustypes of display devices, the OLED display is a self-light-emittingdevice that is considered as a popular display device owing to itstechnical perspectives such as a wide viewing angle.

An OLED display in general includes a pixel circuit and a driverconfigured to drive the pixel circuit. The driver may include a scandriver which provides scan signals to the pixel circuit, a data driverwhich provides data signals to the pixel circuit, and the like. Drivingcircuits of the scan driver and the data driver may be disposed in anon-display area adjacent to a display area. The non-display area isconsidered as a dead space in terms of functions of a display device.

SUMMARY

According to an embodiment of the disclosure, a display device mayinclude a display panel comprising a display area and a non-displayarea, signal wires disposed in the display area, connection wiresdisposed in the display area and electrically connected to the signalwires, and touch electrodes disposed on the connection wires. Theconnection wires may comprise diagonal portions extending in a diagonaldirection, and first protrusion patterns protruding from the diagonalportions of the connection wires. Parts of the first protrusion patternsmay overlap the touch electrodes.

Adjacent ones of the parts of the first protrusion patterns may faceeach other, and a gap between the adjacent ones of the parts of thefirst protrusion patterns may overlap the touch electrodes.

A distance between the adjacent ones of the parts of the firstprotrusion patterns may be smaller than a line width of the touchelectrodes.

The signal wires may extend in a first direction, and the firstprotrusion patterns may protrude in the first direction or a seconddirection intersecting the first direction.

The connection wires may further comprise second protrusion patternsprotruding from an extension portion of the connection wires. Theextension portion may include portions of the connection wires excludingthe diagonal portions. Parts of the second protrusion patterns mayoverlap the touch electrodes.

Adjacent ones of the parts of the second protrusion patterns face eachother, and a gap between the adjacent ones of the parts of the secondprotrusion patterns may overlap the touch electrodes.

A part of at least one of the first protrusion patterns and a prat of atleast one of the second protrusion patterns may adjacent to each other,and a gap between the part of the at least one of the first protrusionpatterns and the part of the at least one of the second protrusionpatterns may overlap the touch electrodes.

The first protrusion patterns and the second protrusion patterns may bealternately disposed in the second direction, and an interval betweenthe first protrusion patterns or between the second protrusion patternsmay be substantially same as an interval between the connection wiresdisposed in the second direction.

A length of the first protrusion patterns in the first direction may bedifferent from a length of the second protrusion patterns in the firstdirection.

The connection wires may comprise a first portion extending from thenon-display area in a first direction, a second portion extending froman end of the first portion in a second direction intersecting the firstdirection, and a third portion extending from an end of the secondportion in a direction opposite to the first direction.

The display device may include a first conductive layer including thesignal wires, and a second conductive layer disposed on the firstconductive layer and including the connection wires, and an insulatinglayer disposed between the first conductive layer and the secondconductive layer. The connection wires may be in contact with the signalwires through a contact hole passing through the insulating layer.

The display device may further comprise a first electrode layer disposedon the second conductive layer, a second electrode layer disposed on thefirst electrode layer, and a light-emitting layer disposed between thefirst electrode layer and the second electrode layer.

The first portion may be electrically connected to the signal wires, andthe third portion may be spaced apart from the first portion.

The display device may further comprise dummy patterns disposed at aside of the connection wires in the display area. The dummy pattern maycomprise a diagonal portions extending in a diagonal direction.

The display device may further comprise first dummy protrusion patternsprotruding from the diagonal portions of the dummy patterns, wherein apart of at least one of the first dummy protrusion patterns a part of atleast one of the first protrusion patterns are adjacent to each other.

A gap between the part of the at least one of the first dummy protrusionpatterns and the part of the at least one of the first protrusionpatterns may overlap the touch electrodes.

A distance between the part of the at least one of the first dummyprotrusion patterns and the part of the at least one of the firstprotrusion patterns may be smaller than a line width of the touchelectrodes.

The dummy patterns the connection wires may be disposed on a sameconductive layer.

The touch electrodes may be disposed in the display area and may furthercomprise first touch electrodes disposed in a first direction, andconnection electrodes that may electrically connect the first touchelectrodes.

The touch electrodes may further comprise second touch electrodesdisposed in a second direction intersecting the first direction. Thefirst touch electrodes and the second touch electrodes may be spacedapart from each other.

The display device may further comprise pixels disposed in the displayarea, and a pixel definition film that defines light-emitting areas ofthe pixels. The touch electrodes may overlap the pixel definition film.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and features of the disclosure will becomemore apparent by describing embodiments in detail with reference to theattached drawings, in which:

FIG. 1 is a plan view illustrating a display device according to anembodiment;

FIG. 2 is a side view illustrating the display device of FIG. 1;

FIG. 3 is a schematic cross-sectional view taken along line of FIG. 1;

FIG. 4 is a plan view illustrating a touch sensing layer of FIG. 3;

FIG. 5 is an enlarged view illustrating area A of FIG. 4;

FIG. 6 is a schematic cross-sectional view taken along line VI-VI′ ofFIG. 5;

FIG. 7 is a plan view illustrating signal wires, connection wires, andfan-out wires of a display device according to an embodiment;

FIG. 8 is an enlarged view illustrating area B of FIG. 7;

FIG. 9 is a schematic cross-sectional view taken along line IX-IX′ ofFIG. 8;

FIG. 10 is an enlarged view illustrating area C of FIG. 7;

FIG. 11 is an enlarged view illustrating area C of FIG. 7 in which atouch sensing layer is applied;

FIG. 12 is a schematic cross-sectional view taken along line XII-XII′ ofFIG. 11;

FIG. 13 is an enlarged view illustrating area D of FIG. 7;

FIG. 14 is a schematic cross-sectional view taken along line XIV-XIV′ ofFIG. 13;

FIG. 15 is a schematic cross-sectional view taken along line XV-XV′ ofFIG. 13;

FIG. 16 is a plan view illustrating a display device according toanother embodiment;

FIG. 17 is an enlarged view illustrating area E of FIG. 16;

FIG. 18 is a schematic cross-sectional view taken along lineXVIII-XVIII′ of FIG. 17;

FIG. 19 is a plan view illustrating signal wires, connection wires, andfan-out wires of a display device according to another embodiment;

FIG. 20 is an enlarged view illustrating area F of FIG. 19;

FIG. 21 is an enlarged view illustrating area F of FIG. 19 in which atouch sensing layer is applied;

FIG. 22 is a schematic cross-sectional view taken along line XXII-XXII′of FIG. 21;

FIG. 23 is a perspective view illustrating a display device according toanother embodiment;

FIG. 24 is a plan view illustrating the display device of FIG. 23; and

FIG. 25 is a plan view illustrating signal wires, connection wires, andfan-out wires of the display device of FIG. 23.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods disclosed herein. It is apparent, however, that variousembodiments may be practiced without these specific details or with oneor more equivalent arrangements. Here, various embodiments do not haveto be exclusive nor limit the disclosure. For example, specific shapes,configurations, and characteristics of an embodiment may be used orimplemented in another embodiment.

Unless otherwise specified, the illustrated embodiments are to beunderstood as providing exemplary features of the invention. Therefore,unless otherwise specified, the features, components, modules, layers,films, panels, regions, and/or aspects, etc. (hereinafter individuallyor collectively referred to as “elements”), of the various embodimentsmay be otherwise combined, separated, interchanged, and/or rearrangedwithout departing from the inventive concepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the X-axis, the Y-axis,and the Z-axis are not limited to three axes of a rectangular coordinatesystem, such as the x, y, and z axes, and may be interpreted in abroader sense. For example, the X-axis, the Y-axis, and the Z-axis maybe perpendicular to one another, or may represent different directionsthat are not perpendicular to one another. For the purposes of thisdisclosure, “at least one of X, Y, and Z” and “at least one selectedfrom the group consisting of X, Y, and Z” may be construed as X only, Yonly, Z only, or any combination of two or more of X, Y, and Z, such as,for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various embodiments are described herein with reference to sectionaland/or exploded illustrations that are schematic illustrations ofembodiments and/or intermediate structures. As such, variations from theshapes of the illustrations as a result, for example, of manufacturingtechniques and/or tolerances, are to be expected. Thus, embodimentsdisclosed herein should not necessarily be construed as limited to theparticular illustrated shapes of regions, but are to include deviationsin shapes that result from, for instance, manufacturing. In this manner,regions illustrated in the drawings may be schematic in nature and theshapes of these regions may not reflect actual shapes of regions of adevice and, as such, are not necessarily intended to be limiting.

As customary in the field, some embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some exemplary embodiments may be physically separated intotwo or more interacting and discrete blocks, units, and/or moduleswithout departing from the scope of the inventive concepts. Further, theblocks, units, and/or modules of some exemplary embodiments may bephysically combined into more complex blocks, units, and/or moduleswithout departing from the scope of the inventive concepts.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a plan view illustrating a display device according to anembodiment. FIG. 2 is a side view illustrating the display device ofFIG. 1.

Referring to FIGS. 1 to 2, a display device 1 is a device which displaysimages, for example, a still image or a moving image. The display device1 may be used in portable electronic devices such as a mobile phone, asmartphone, a tablet personal computer (PC), a smart watch, a watchphone, a mobile communication terminal, an electronic notebook, anelectronic book, a portable multimedia player (PMP), a navigationdevice, and an ultra mobile PC (UMPC) and may also be used as a displayscreen of various products such as a television, a laptop computer, amonitor, a billboard, and a device for Internet of things (IoT).

The display device 1 may include a display panel 10. The display panel10 may be a flexible substrate including a flexible polymer materialsuch as polyimide. Accordingly, the display panel 10 may be flexible,bendable, foldable, and/or rollable.

The display panel 10 may include a display area DA in which an image isdisplayed and a non-display area NDA in which no image is displayed andwhich excludes the display area DA. The display area DA may includepixels PX.

The display panel 10 may include a main area MR and a bent area BRconnected to a side of the main area MR. The display panel 10 mayinclude a sub-area SR which is connected to the bent area BR andoverlaps the main area MR in a thickness direction thereof.

The main area MR may include the display area DA. A peripheral edgeportion around the display area DA of the main area MR may be thenon-display area NDA.

The main area MR may have a planar shape which may be an exterior shapeof the display device 1. The main area MR may be a flat area positionedon one surface. However, the disclosure is not limited thereto. Forexample, in the main area MR, at least one edge of the remaining edgesexcept for an edge (side) connected to the bent area BR may be bent toform a curved surface or be bent in a vertical direction.

In the main area MR, when at least one edge of the remaining edgesexcluding the edge (side) connected to the bent area BR forms the curvedsurface or is bent, the display area DA may be disposed in or extendedto the corresponding area. However, the disclosure is not limitedthereto, For example, the non-display area NDA in which no image isdisplayed may be disposed at the curved or bent edge, or the displayarea DA and the non-display area NDA may be disposed together at thecurved or bent edge.

The non-display area NDA of the main area MR may be disposed in an areafrom an outer boundary of the display area DA to an edge of the displaypanel 10. A signal wire DL, a connection wire DM, or a driving circuitfor applying a signal to the display area DA may be disposed in thenon-display area NDA of the main area MR. In addition, an outermostblack matrix may be disposed in the non-display area NDA of the mainarea MR, but the disclosure is not limited thereto.

The bent area BR is connected to the main area MR. For example, the bentarea BR may be connected to one short side of the main area MR. In thebent area BR, the display panel 10 may be bent with a curvature downwardin a direction opposite to a third direction DR3, that is, in adirection opposite to a display surface. As the display panel 10 is bentin the bent area BR, a surface of the display panel 10 may be reversed.That is, one surface of the display panel 10 facing upward may bechanged to face outward through the bent area BR and then face downward.

The sub-area SR extends from the bent area BR. The sub-area SR mayextend from a side, at which the display panel 10 is bent (or completelybent), in a direction substantially parallel to the main area MR. Thesub-area SR may overlap the main area MR in the third direction DR3,that is, in the thickness direction of the display panel 10. Thesub-area SR may overlap the non-display area NDA of an edge of the mainarea MR and may further overlap the display area DA of the main area MR.

A driving chip 20 may be disposed in the sub-area SR of the displaypanel 10 (or a pad portion on which the driving chip 20 is disposed andwhich is electrically connected to the driving chip 20). The drivingchip 20 may generate a driving signal necessary for driving the pixel PXand provide the driving signal to the pixel PX defined in the displayarea DA. For example, the driving chip 20 may generate a data signal fordetermining luminance of the pixel PX. The driving chip 20 may supplythe data signal to the pixel PX through a connection wire DM and asignal wire DL (referring to FIG. 7).

The driving chip 20 may be attached onto the display panel 10 through ananisotropic conductive film or attached onto the display panel 10through ultrasonic bonding. A width of the driving chip 20 in a seconddirection DR2 may be less than a width of the display panel 10 in thesecond direction DR2.

A driving substrate 30 may be connected to an end portion of thesub-area SR of the display panel 10. The pad portion may be provided atthe end portion of the sub-area SR, and the driving substrate 30 may beconnected onto the pad portion. The driving substrate 30 may be aflexible printed circuit board or film.

FIG. 3 is a schematic cross-sectional view taken along line of FIG. 1.

Referring to FIG. 3, the display device 1 may include a substrate 101, athin film transistor layer TFTL, a light-emitting element layer EML, athin film encapsulation layer TFEL, and a touch sensing layer TSL.

The substrate 101 may be a flexible substrate which is bendable,foldable, and rollable. For example, the flexible substrate may includepolyethersulphone (PES), polyacrylate (PA), polyarylate (PAR),polyetherimide (PEI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate,polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT),cellulose acetate propionate (CAP), or a combination thereof.

The thin film transistor layer TFTL may be disposed on the substrate101. Thin film transistors of each pixel PX, scan lines, data lines,power lines, scan control lines, and link lines connecting pads and datalines may be formed in the thin film transistor layer TFTL. Each of thethin film transistors may include a gate electrode, a semiconductorlayer, a source electrode, and a drain electrode.

The thin film transistor layer TFTL may be disposed in the display areaDA and the non-display area NDA. Specifically, the thin film transistorsof each of the pixels PX, the scan lines, the data lines, and the powerlines of the thin film transistor layer TFTL may be disposed in thedisplay area DA. The scan control lines and the link lines of the thinfilm transistor layer TFTL may be disposed in the non-display area NDA.

The light-emitting element layer EML may be disposed on the thin filmtransistor layer TFTL. The light-emitting element layer EML may includethe pixels PX which each may include a first electrode, a light-emittinglayer, and a second electrode, and a pixel definition film which defineseach of the pixels. The light-emitting layer may be an organiclight-emitting layer including an organic material. The light-emittinglayer may include a hole transporting layer, an organic light-emittinglayer, and an electron transporting layer. When a predetermined orselected voltage is applied to the first electrode through the thin filmtransistor of the thin film transistor layer TFTL and a cathode voltageis applied to the second electrode, holes and electrons may move to theorganic light-emitting layer through the hole transporting layer and theelectron transporting layer, and may be combined with each other in theorganic light-emitting layer to emit light. The pixels of thelight-emitting element layer EML may be disposed in the display area DA.A schematic cross-sectional structure of each pixel will be describedbelow with reference to FIG. 12.

The thin film encapsulation layer TFEL may be disposed on thelight-emitting element layer EML. The thin film encapsulation layer TFELmay serve to prevent oxygen or moisture from permeating into thelight-emitting element layer EML. To this end, the thin filmencapsulation layer TFEL may include at least one inorganic film. Theinorganic film may include a silicon nitride layer, a silicon oxynitridelayer, a silicon oxide layer, a titanium oxide layer, or an aluminumoxide layer, but the disclosure is not limited thereto. In addition, thethin film encapsulation layer TFEL serves to protect the light-emittingelement layer EML from foreign substances such as dust. To this end, thethin film encapsulation layer TFEL may include at least one organicfilm. The organic film may be made of acryl resin, epoxy resin, phenolicresin, polyamide resin, polyimide resin, or the like, but the disclosureis not limited thereto.

The thin film encapsulation layer TFEL may be disposed in both of thedisplay area DA and the non-display area NDA. Specifically, the thinfilm encapsulation layer TFEL may be disposed to cover thelight-emitting element layer EML of the display area DA and thenon-display area NDA and to cover the thin film transistor layer TFTL ofthe non-display area NDA.

The touch sensing layer TSL may be disposed on the thin filmencapsulation layer TFEL. Since the touch sensing layer TSL is disposeddirectly on the thin film encapsulation layer TFEL, a thickness of thedisplay device 1 may be decreased as compared with a case in which aseparate touch panel including the touch sensing layer TSL is attachedonto the thin film encapsulation layer TFEL.

The touch sensing layer TSL may include touch electrodes for sensing atouch of a user using a capacitance method and routing lines connectingthe pads and the touch electrodes. For example, the touch sensing layerTSL may sense the touch of the user using a self-capacitance method or amutual capacitance method.

A cover window may be additionally disposed on the touch sensing layerTSL, and the touch sensing layer TSL and the cover window may beattached to each other by a transparent adhesive member. Meanwhile, thearrangement of the touch sensing layer TSL is not limited to that shownin FIG. 3, and the position thereof is not particularly limited as longas the touch sensing layer TSL is disposed between the light-emittingelement layer EML and the cover window.

Hereinafter, the touch sensing layer TSL will be described in moredetail.

FIG. 4 is a plan view illustrating the touch sensing layer of FIG. 3.FIG. 5 is an enlarged view illustrating area A of FIG. 4. FIG. 6 is aschematic cross-sectional view taken along line VI-VI′ of FIG. 5.

Referring to FIGS. 4 to 6, the touch sensing layer TSL includes a touchsensing area TSA for sensing a touch of a user and a touch peripheralarea TPA disposed at a periphery of the touch sensing area TSA.

Touch electrode pads TP1 and TP2 and routing lines TL1, TL2, and RL maybe disposed in the touch peripheral area TPA.

The touch electrode pads TP1 and TP2 may be disposed at a side of thedisplay device 1. A touch circuit board may be attached onto the touchelectrode pads TP1 and TP2 using, for example, an anisotropic conductivefilm. As a result, the touch electrode pads TP1 and TP2 may beelectrically connected to the touch circuit board.

The routing lines TL1, TL2, and RL may include first routing lines TL1,second routing lines TL2, and third routing lines RL.

The first routing lines TL1 may be connected to one sides of first touchelectrodes TE. In an embodiment, one ends of the first routing lines TL1may be connected to the first touch electrodes TE disposed at a firstportion of the touch sensing area TSA. Among four portions of the touchsensing area TSA, the first portion of the touch sensing area TSA may bea portion closer to a touch pad area in which the touch electrode padsTP1 and TP2 are disposed. The other ends of the first routing lines TL1may be connected to some of the first touch electrode pads TP1 of thetouch pad area. The first routing line TL1 may serve to connect the onesides of the first touch electrodes TE and the first touch electrodepads TP1.

The second routing lines TL2 may be connected to the other sides of thefirst touch electrodes TE. In an embodiment, one ends of the secondrouting lines TL2 may be connected to the first touch electrodes TEdisposed at a second portion of the touch sensing area TSA. The secondportion of the touch sensing area TSA may be a portion opposite to thefirst portion of the touch sensing area TSA. Among the four portions ofthe touch sensing areas TSA, the second portion of the touch sensingarea TSA may be a portion positioned farther from the touch pad area inwhich the touch electrode pads TP1 and TP2 are disposed. The secondrouting lines TL2 may be connected to the first touch electrodes TEdisposed at the second portion via the first portion and a fourthportion of the touch sensing area TSA. The other ends of the secondrouting lines TL2 may be connected to others of the first touchelectrode pads TP1 of the touch pad area. The second routing line TL2may serve to connect the other sides of the first touch electrodes TEand the first touch electrode pads TP1.

The third routing lines RL may be connected to one sides of second touchelectrodes RE. One ends of the third routing lines RL may be connectedto the second touch electrodes RE disposed at a third portion of thetouch sensing area TSA. The third portion of the touch sensing area TSAmay be a portion opposite to the fourth portion and may be a portiondisposed between the first portion and the second portion in the seconddirection DR2. The other ends of the third routing lines RL may beconnected to the second touch electrode pads TP2 of the touch pad area.The third routing line RL may serve to connect the second touchelectrodes RE and the second touch electrode pads TP2.

Although not shown in the drawings, a ground line may be furtherdisposed outside the routing lines TL1, TL2, and RL.

The ground line may be disposed at an outermost side of the touchsensing layer TSL. A ground voltage may be applied to the ground line.Accordingly, when static electricity is applied from the outside, thestatic electricity may be discharged to the ground line. One end of theground line may be electrically connected to the touch electrode padsTP1 and TP2.

A guard line may be further disposed between the routing lines and theground line. The guard line may serve to minimize coupling between therouting lines or minimize coupling between the routing lines and theground line. The routing lines may be electrically connected to thetouch electrode pads TP1 and TP2.

The touch sensing area TSA may overlap the display area DA. The touchelectrodes TSP may be disposed in the touch sensing area TSA. The touchelectrodes TSP may be disposed to overlap a pixel definition film 160that defines each pixel PX. Each pixel PX may include subpixels R, G1,G2, and B. The touch electrodes TSP may be disposed to overlap the pixeldefinition film 160 that defines each of the subpixels R, G1, G2, and B.Such structure and configuration of the touch electrodes TSP may preventa reduction in aperture area of the subpixels R, G1, G2, and B.

The subpixels R, G1, G2, and B may include first subpixels R that emitsa first color, second subpixels G1 and G2 that emit a second color, andthird subpixels B that emit a third color. The second subpixels G1 andG2 may include second-A subpixels G1 and second-B subpixels G2. Onefirst subpixel R, two second subpixels (i.e., one second-A subpixel G1and one second-B subpixel G2), and one third subpixel B may be definedas (or constitute) one pixel PX.

For example, as shown in FIG. 5, the first subpixels R and the thirdsubpixels B may be alternately disposed in a first column in a firstdirection DR1, and the second-A subpixels G1 and the second-B subpixelsG2 may be alternately disposed in a second column in the first directionDR1.

The subpixels R, G1, G2, and B may have different shapes and sizes. FIG.5 illustrates that the third subpixel B has the largest size and thesecond subpixels G1 and G2 have the smallest size, but the sizes of thesubpixels R, G1, G2, and B are not limited thereto. A schematiccross-sectional structure of each of the subpixels R, G1, G2, and B willbe described in detail below with reference to FIG. 12.

The touch electrodes TSP may include the first touch electrodes TE, thesecond touch electrodes RE, and connection electrodes BE.

The first touch electrodes TE and the second touch electrodes RE may bedisposed to be spaced apart from each other. The first touch electrodesTE may be disposed in columns in the first direction DR1, and the secondtouch electrodes RE may be disposed in rows in the second direction DR2.The first touch electrodes TE disposed in each of the columns in thefirst direction DR1 may be electrically connected. The second touchelectrodes RE disposed in each of the rows in the second direction DR2may be electrically connected.

The first touch electrodes TE and the second touch electrodes RE mayhave a diamond or triangular shape in a plan view. In an embodiment, thefirst touch electrodes TE and the second touch electrodes RE disposed atedges of the touch sensing area TSA may have a triangular shape in aplan view, and other first touch electrodes TE and second touchelectrodes RE may have a diamond shape in a plan view.

As shown in FIG. 5, the first touch electrodes TE and the second touchelectrodes RE may be formed as mesh-shaped electrodes. When the touchsensing layer TSL including the first touch electrodes TE and the secondtouch electrodes RE is formed on (or directly on) the thin filmencapsulation layer TFEL, a distance between the second electrode of thelight-emitting element layer EML and the first touch electrodes TE orthe second touch electrodes RE of the touch sensing layer TSL may besmall. Thus, high parasitic capacitance may be formed between the secondelectrode of the light-emitting element layer EML and the first touchelectrodes TE or the second touch electrodes RE of the touch sensinglayer TSL. In order to reduce the parasitic capacitance, the first touchelectrodes TE and the second touch electrodes RE may be formed as themesh-shaped electrodes as shown in FIG. 5 rather than unpatternedelectrodes of a conductive layer made of a transparent oxide such asindium tin oxide (ITO) or indium zinc oxide (IZO).

The first touch electrodes TE and the second touch electrodes RE may bedisposed to be spaced apart from each other, and the first touchelectrodes TE adjacent to each other in the first direction DR1 may beelectrically connected to each other through the connection electrodesBE. The first touch electrodes TE and the second touch electrodes RE maybe disposed to be coplanar, and the connection electrodes BE may bedisposed to not be coplanar with the first touch electrodes TE and thesecond touch electrodes RE. For example, as shown in FIG. 6, the firsttouch electrodes TE and the second touch electrodes RE may be formed ofa second touch conductive layer 152, and the connection electrodes BEmay be formed of a first touch conductive layer 151. A second touchinsulating layer TIL2 may be disposed between the first touch conductivelayer 151 and the second touch conductive layer 152. The first touchelectrodes TE may be electrically connected to the connection electrodesBE through a first contact hole CNT1 passing through the second touchinsulating layer TIL2 and exposing ends of the connection electrodes BE.

In an embodiment, the touch electrodes TSP, which may be the first touchelectrodes TE, the second touch electrodes RE, or the connectionelectrodes BE, may be disposed to overlap a gap G between protrusionpatterns PP1 and PP2 to be described below. The touch electrodes TSP mayblock the gap G formed in the display area DA, thereby preventing aphenomenon such as reflection of external light from the gaps G and/orvisibility of a spot. This will be described in detail below.

Hereinafter, the signal wires DL, the connection wires DM, and fan-outwires F for transmitting driving signals will be described in detail.

FIG. 7 is a plan view illustrating the signal wires DL, the connectionwires DM, and the fan-out wires F of the display device 1 according toan embodiment. FIG. 8 is an enlarged view illustrating area B of FIG. 7.FIG. 9 is a schematic cross-sectional view taken along line IX-IX′ ofFIG. 8. FIG. 10 is an enlarged view illustrating area C of FIG. 7. FIG.11 is an enlarged view illustrating area C of FIG. 7 in which a touchsensing layer TSL is applied. FIG. 12 is a schematic cross-sectionalview taken along line XII-XII′ of FIG. 11. FIG. 13 is an enlarged viewillustrating area D of FIG. 7. FIG. 14 is a schematic cross-sectionalview taken along line XIV-XIV′ of FIG. 13. FIG. 15 is a schematiccross-sectional view taken along line XV-XV′ of FIG. 13.

Referring to FIGS. 7 to 15, the display device 1 may include the signalwires DL, the connection wires DM, and the fan-out wires F.

The signal wires DL, the connection wires DM, and the fan-out wires Fmay be formed to extend in the first direction DR1 or the seconddirection DR2 and disposed to be substantially symmetrical with respectto a reference axis (not shown) passing through a center area of thedisplay device 1. Hereinafter, the signal wires DL, the connection wiresDM, and the fan-out wires F disposed at a left side of the displaydevice 1 will be described.

The signal wires DL may extend from the non-display area NDA of the mainarea MR and may be disposed in the display area DA. The signal wires DLmay extend in the first direction DR1 and may be disposed (orsequentially disposed) at an interval in the second direction DR2. Thesecond direction DR2 may be a direction intersecting the first directionDR1 and may be perpendicular to the first direction DR1.

The signal wires DL (or their ends) may be electrically connected to theconnection wires DM. The signal wires DL electrically connected to theconnection wires DM may be disposed in the non-display area NDA at alower portion of the main area MR. The signal wires DL may be, forexample, data lines for transmitting data signals to the pixels PX.

The connection wires DM may extend from the non-display area NDA of themain area MR to the non-display area NDA of the sub-area SR via thedisplay area DA. The connection wires DM may be electrically connectedto the signal wires DL in the non-display area NDA of the main area MR.

The connection wires DM may be disposed to not be coplanar with a layerin which the signal wires DL are disposed. The connection wires DM maybe insulated from the signal wires DL through an insulating layer. Forexample, as shown in FIGS. 8 and 9, the signal wires DL may beimplemented with a third conductive layer 130, the connection wires DMmay be implemented with a fourth conductive layer 140, and the signalwires DL and the connection wires DM may be insulated from each other bya fourth insulating layer IL4. The third conductive layer 130 mayinclude the signal wires DL, and the fourth conductive layer may includethe connection wires DM. The connection wires DM may be electricallyconnected to the signal wires DL through a contact hole passing throughthe fourth insulating layer IL4 and exposing ends of the signal wiresDL.

Each of the connection wires DM may include a first portion DM1extending from the non-display area NDA in the first direction DR1, asecond portion DM2 extending from one end of the first portion DM1 inthe second direction DR2, and a third portion DM3 extending from one endof the second portion DM2 in a direction opposite to the first directionDR1. The first portion DM1 of each connection wire DM may beelectrically connected to a corresponding one of the signal wires DL,and the third portion DM3 thereof may be electrically connected to acorresponding one of the fan-out wires F. Accordingly, each connectionwire DM may receive a driving signal from the driving chip 20 throughthe third portion DM3 and may provide the driving signal to the pixel PXthrough the first portion DM1. The first portion DM1 and the thirdportion DM3 may be disposed to be spaced apart from each other, and thesecond portion DM2 may be disposed between the first portion DM1 and thethird portion DM3.

As described above, the display device 1 may include the connectionwires DM disposed via the display area DA, and an image signal may beprovided to the signal wires DL through the connection wires DM.Therefore, an additional dead space which otherwise would be requiredfor connecting the signal wire DL directly to the fan-out wire F may beunnecessary. As a result, a dead space may be reduced or minimized.

The connection wires DM may be partially bent and include a diagonalportion DMB extending in a diagonal direction. The diagonal portion DMBmay be a portion in which a connection wire DM is bent in a firstdiagonal direction DR4 or a second diagonal direction DR5. Here, thefirst diagonal direction DR4 may refer to a diagonal direction betweenthe first direction DR1 and the second direction DR2, and the seconddiagonal direction DR5 may refer to a diagonal direction between thefirst direction DR1 and a direction opposite to the second directionDR2.

As shown in FIG. 10, the diagonal portion DMB may have a shape that isbent in the first diagonal direction DR4 and/or the second diagonaldirection DR5 from an end of a connection wire DM which extends in thefirst direction DR1.

The diagonal portion DMB may have a shape protruding from a side of theconnection wire DM. For example, as shown in FIG. 10, the diagonalportion DMB may protrude in a direction opposite to the first diagonaldirection DR4 from a side of the connection wire DM. The diagonalportion DMB may protrude in the second diagonal direction DR 5 from aside of the connection wire DM.

The connection wires DM may include the protrusion patterns PP1 and PP2protruding from a side of the respective connection wires DM. Theprotrusion patterns PP1 and PP2 may include first protrusion patternsPP1 each protruding from the diagonal portion DMB of the respectiveconnection wires DM and second protrusion patterns PP2 each protrudingfrom an extension portion of the respective connection wires DM. Theextension portion may include portions of a connection wire DM excludingthe diagonal portion DMB. For example, the extension portion of aconnection wire DM may be any portion of the connection wire DMexcluding the diagonal portion DMB.

The first protrusion patterns PP1 each may have a shape protruding froma side of the diagonal portion DMB. The first protrusion patterns PP1may protrude in the first direction DR1, in a direction opposite to thefirst direction DR1, in the second direction DR2, and/or in a directionopposite to the second direction DR2.

Adjacent ones of the first protrusion patterns PP1 may face each other.The first protrusion patterns PP1 may include parts (or end parts) thatmay overlap the touch electrodes TSP. Adjacent ones of the parts of thefirst protrusion patterns PP1 may face each other.

A gap G may be defined between the parts of the first protrusionpatterns PP1. For example, the gap G may be between the adjacent partsof the first protrusion patters PP1 which face each other. The gaps Gbetween the parts of the first protrusion patterns PP1 may overlap thetouch electrodes TSP. The gaps G may overlap the first touch electrodesTE, the second touch electrodes RE, or the connection electrodes BE.

A width of the gaps G between the parts (or end parts) of the firstprotrusion patterns PP1 may be smaller than a line width of the touchelectrodes TSP. In addition, the width of the gaps G may be smaller thana line width of the connection wires DM. The width of the gaps G may bea distance between the parts (or end parts) of the first protrusionpatterns PP1 which face each other.

The width of the gaps G may be in a range of about 2.0 μm to about 3.0μm. The line width of the touch electrodes TSP may be in a range ofabout 3.2 μm to about 4.8 μm. However, the disclosure is not limitedthereto. In other embodiments, for example, the line width of the touchelectrodes TSP may be in a range of about 4.8 μm to about 7.2 μm. Anarea in which the touch electrodes TSP overlap the gaps G may beincreased, and thus, it is possible to more effectively prevent aphenomenon such as reflection of external light from the gaps G and/orvisibility a spot. The line width of the connection wires DM may be in arange of about 2.4 μm to about 3.6 μm. However, the width of the gaps Gand the line width of the wires are not limited thereto. For example, aslong as the gaps G overlap the touch electrodes TSP, the line width ofthe wires may be in any range.

Since the gaps G between the first protrusion patterns PP1 overlap thetouch electrodes TSP, the gaps G formed in the display area DA may beblocked by the touch electrodes TSP, thereby preventing a phenomenonsuch as reflection of external light from the gaps G and/or visibilityof a spot. The second protrusion patterns PP2 may have a shapeprotruding from the extension portions of the connection wires DMexcluding the diagonal portion DMB. The second protrusion patterns PP2may protrude in the first direction DR1, in the direction opposite tothe first direction DR1, in the second direction DR2, and/or in thedirection opposite to the second direction DR2.

Adjacent ones of the second protrusion patterns PP2 may face each other.The second protrusion patterns PP2 may include parts (or end parts) thatmay overlap the touch electrodes TSP. Adjacent ones of the parts of thesecond protrusion patterns PP2 may face each other.

A gap G may be defined between the parts of the second protrusionpatterns PP2 which face each other. The gaps G between the parts of thesecond protrusion patterns PP2 may overlap the touch electrodes TSP. Thegaps G may overlap the first touch electrodes TE, the second touchelectrodes RE, or the connection electrodes BE.

A width of the gaps G between parts (or end parts) of the secondprotrusion patterns PP2 may be smaller than the line width of the touchelectrodes TSP. In addition, the width of the gaps G may be smaller thanthe line width of the connection wires DM. The width of the gaps G maybe a distance between the parts (or end parts) of the second protrusionpatterns PP2, which face each other.

The width of the gaps G may be in a range of about 2.0 μm to about 3.0μm. The line width of the touch electrodes TSP may be in a range ofabout 3.2 μm to about 4.8 μm. However, the disclosure is not limitedthereto. In other embodiments, for example, the line width of the touchelectrodes TSP may be in a range of about 4.8 μm to about 7.2 μm. Anarea in which the touch electrodes TSP overlap the gaps G may beincreased, and it is possible to more effectively prevent a phenomenonsuch as reflection of external light from the gaps G and/or visibilityof a spot. The line width of the connection wires DM may be in a rangeof about 2.4 μm to about 3.6 μm. However, the width of the gaps G andthe line width of the wires are not limited thereto. For example, aslong as the gaps G between the second protrusion patterns PP2 overlapthe touch electrodes TSP, the line width of the wires may be in anyrange.

Since the gaps G between the second protrusion patterns PP2 overlap thetouch electrodes TSP, the gaps G formed in the display area DA may beblocked by the touch electrodes TSP, thereby preventing a phenomenonsuch as reflection of external light from the gaps G and/or visibilityof a spot.

A part (or end part) of at least one of the first protrusion patternsPP1 and a part (or end part) of at least one of the second protrusionpatterns PP2 may be adjacent and face each other, and may overlap thetouch electrodes TSP.

A gap G may be defined between the part of the at least one of the firstprotrusion patterns PP1 and the part of the at least one of the secondprotrusion patterns PP2 which face each other. The gap G may overlapeach of the touch electrodes TSP. The gaps G between parts of the firstprotrusion patterns PP1 and the parts of the second protrusion patternsPP2 may overlap the first touch electrodes TE, the second touchelectrodes RE, or the connection electrodes BE. The gaps G formed in thedisplay area DA may be blocked by the touch electrodes TSP, therebypreventing a phenomenon such as reflection of external light from thegaps G and/or visibility of a spot.

The first protrusion patterns PP1 and the second protrusion patterns PP2may be alternately disposed in the second direction DR2. The firstprotrusion patterns PP1 may be disposed between the second protrusionpatterns PP2.

The first protrusion patterns PP1 and/or the second protrusion patternsPP2 may be disposed at an interval in the first direction DR1. Forexample, an interval between the first protrusion patterns PP1 or thesecond protrusion patterns PP2 disposed in the first direction DR1 maybe substantially the same as an interval between the connection wires DMdisposed in the first direction DR1.

The first protrusion patterns PP1 and/or the second protrusion patternsPP2 may be disposed at an interval in the second direction DR2. Forexample, an interval between the first protrusion patterns PP1 or thesecond protrusion patterns PP2 disposed in the second direction DR1 maybe substantially the same as an interval between the connection wires DMdisposed in the second direction DR2.

The first protrusion patterns PP1 each may be disposed at a side of eachof the second subpixels G1 and G2, and the second protrusion patternsPP2 each may be disposed at another side of each of the second subpixelsG1 and G2.

When the protrusion patterns PP1 and PP2 extend in the first directionDR1, a length of the first protrusion patterns PP1 in the firstdirection DR1 may be different from a length of the second protrusionpatterns PP2 in the first direction DR1.

When the protrusion patterns PP1 and PP2 extend in the second directionDR2, a length of the first protrusion patterns PP1 in the seconddirection DR2 may be different from a length of the second protrusionpatterns PP2 in the second direction DR2.

FIG. 12 illustrates an embodiment where the gaps G between theprotrusion patterns PP1 and PP2 overlap the first touch electrodes TE,but the embodiments are not limited thereto. In other embodiments, thegaps G between the protrusion patterns PP1 and PP2 may overlap the firsttouch electrodes TE or the connection electrodes BE.

The fan-out wires F may extend from the driving chip 20 of the sub-areaSR to the non-display area NDA of the main area MR.

The fan-out wires F may be electrically connected to the signal wires DLor the connection wires DM. Some of the fan-out wires F may be directlyconnected to some of the signal wires DL, and the rest of the fan-outwires F may be directly connected to the connection wires DM andconnected to the signal wires DL using the connection wires DM.

The fan-out wires F may include first fan-out wires F1 and secondfan-out wires F2. FIG. 7 illustrates an embodiment where the firstfan-out wires F1 are directly connected to the signal wire DL and thesecond fan-out wires F2 are directly connected to the connection wireDM, but the embodiment are not limited thereto. In other embodiments,the first fan-out wires F1 may be directly connected to the connectionwire DM, and the second fan-out wires F2 may be directly connected tothe signal wire DL.

As shown in FIG. 13, each of the fan-out wires F may include a mainfan-out wire 111 or 121, a bending fan-out wire 141, and a sub-fan-outwire 112 or 122.

The main fan-out wires 111 and 121 and the sub-fan-out wires 112 and 122may be spaced apart from each other, and the bending fan-out wires 141may serve to connect the main fan-out wires 111 and 121 and thesub-fan-out wires 112 and 122.

The main fan-out wires 111 and 121 may be disposed in the non-displayarea NDA of the main area MR. One end of the main fan-out wire 111 or121 may be connected to a corresponding one of the connection wires DMor the signal wires DL. Another end of the main fan-out wire 111 or 121may be connected to the bending fan-out wire 141.

The main fan-out wires 111 and 121 may be connected (or directlyconnected) to the connection wires DM or the signal wires DL at a sideof the non-display area NDA of the main area MR.

The main fan-out wires 111 and 121 may be disposed to not be coplanarwith a layer in which the connection wires DM or the signal wires DL aredisposed. The main fan-out wires 111 and 121 may be insulated from theconnection wires DM or the signal wires DL by an insulating layer. Someof the main fan-out wires 111 and 121 may be disposed to not be coplanarand may be insulated from each other by an insulating layer.

For example, as shown in FIGS. 13 and 14, first main fan-out wires 111of the first fan-out wires F1 may be connected (or directly connected)to the signal wires DL. The first main fan-out wires 111 may beimplemented with a first conductive layer 110, and the signal wires DLmay be implemented with the third conductive layer 130. The firstconductive layer 110 may include the first main fan-out wires 111. Thefirst main fan-out wires 111 may be insulated from the signal wires DLby a second insulating layer IL2 and a third insulating layer IL3. Thesignal wires DL may be connected (or directly connected) to the firstmain fan-out wires 111, respectively, through a contact hole passingthrough the second insulating layer IL2 and the third insulating layerIL3 and exposing ends of the first main fan-out wires 111.

As shown in FIGS. 13 and 15, second main fan-out wires 121 of the secondfan-out wires F2 may be connected (or directly connected) to theconnection wires DM. The second main fan-out wires 121 may be disposednot to be coplanar with a layer in which the first main fan-out wires111 are disposed. The second main fan-out wires 121 may be implementedwith a second conductive layer 120, the connection wires DM may beimplemented with the fourth conductive layer 140. The second conductivelayer 120 may include the second main fan-out wires 121. The second mainfan-out wires 121 and the connection wires DM may be insulated from eachother by the third insulating layer IL3 and the fourth insulating layerIL4. The connection wires DM may be connected (or directly connected) tothe second main fan-out wires 121, respectively, through a contact holepassing through the third insulating layer IL3 and the fourth insulatinglayer IL4 and exposing ends of the second main fan-out wires 121.

The sub-fan-out wires 112 and 122 may be disposed in the sub-area SR.

The sub-fan-out wires 112 and 122 may extend in the first direction DR1and may be disposed (or sequentially disposed) at an interval in thesecond direction DR2. The sub-fan-out wires 112 and 122 may be spacedapart from each other. The sub-fan-out wires 112 and 122 may not overlapeach other in the thickness direction.

The sub-fan-out wires 112 and 122 may be spaced apart from the mainfan-out wires 111 and 121. The sub-fan-out wires 112 and 122 may beelectrically connected to the main fan-out wires 111 and 121 by thebending fan-out wires 141. Ends of the sub-fan-out wires 112 and 122 maybe connected to output terminals of the driving chip 20, and other endsof the sub-fan-out wires 112 and 122 may be connected to bendingconnection wires 410. The sub-fan-out wires 112 and 122 may be disposedto be coplanar with a layer in which the main fan-out wires 111 and 121are disposed.

For example, as shown in FIGS. 13 and 14, an end of a first sub-fan wire112 of the first fan-out wire F1 may be connected to a correspondingbending fan-out wire 141. The first sub-fan-out wires 112 may beelectrically connected to the first main fan-out wires 111 by thebending fan-out wires 141. The first sub-fan-out wires 112 may bedisposed to be coplanar with the first main fan-out wires 111. The firstsub-fan-out wires 112 may be implemented with the first conductive layer110. The first conductive layer 110 may include the first sub-fan-outwires 112.

As shown in FIGS. 13 and 15, an end of a second sub-fan-out wire 122 ofthe second fan-out wire F2 may be connected to a corresponding bendingfan-out wire 141. The second sub-fan-out wires 122 may be electricallyconnected to the second main fan-out wires 121 by the bending fan-outwires 141. The second sub-fan-out wires 122 may be disposed to becoplanar with the second main fan-out wires 121. The second sub-fan-outwires 122 may be implemented with the second conductive layer 120. Thesecond conductive layer 120 may include the second sub-fan-out wires122.

The bending fan-out wires 141 may be disposed in the bent area BR. Thebending fan-out wires 141 may extend in the first direction DR1 and maybe disposed (or sequentially disposed) at an interval in the seconddirection DR2.

Ends of the bending fan-out wires 141 may extend to the non-display areaNDA of the main area MR and may be connected to the main fan-out wires111 and 121. Other ends of the bending fan-out wires 141 may extend tothe sub-area SR and may be connected to the sub-fan-out wires 112 and122. The main fan-out wires 111 and 121 and the sub-fan-out wires 112and 122 may be connected by the bending fan-out wires 141.

The bending fan-out wires 141 may be disposed to not be coplanar withthe layer in which the main fan-out wires 111 and 121 and thesub-fan-out wires 112 and 122 are disposed. The bending fan-out wires141 may be insulated from the main fan-out-wires 111 and 121 and thesub-fan-out wires 112 and 122 by an insulating layer. The bendingfan-out wires 141 may be disposed to be coplanar with the connectionwires DM. The bending fan-out wires 141 may be implemented with thefourth conductive layer 140. The fourth conductive layer 140 may includethe bending fan-out wires 141.

For example, as shown in FIGS. 13 and 14, the bending fan-out wires 141of the first fan-out wires F1 may connect the first main fan-out wires111 and the first sub-fan-out wires 112. The bending fan-out wires 141may be insulated from the first main fan-out wires 111 and the firstsub-fan-out wires 112 by the second insulating layer IL2, the thirdinsulating layer IL3, and the fourth insulating layer IL4. Ends of thebending fan-out wires 141 may be connected to the first main fan-outwires 111, respectively, through a contact hole passing through thesecond insulating layer IL2, the third insulating layer IL3, and thefourth insulating layer IL4 and exposing ends of the first main fan-outwires 111. Other ends of the bending fan-out wires 141 may be connectedto the first sub-fan-out wires 112, respectively, through a contact holepassing through the second insulating layer IL2, the third insulatinglayer IL3, and the fourth insulating layer IL4 and exposing ends of thesecond sub-fan-out wires 122.

As shown in FIGS. 13 and 15, the bending fan-out wires 141 of the secondfan-out wires F2 may connect the second main fan-out wires 121 and thesecond sub-fan-out wires 122. The bending fan-out wires 141 may beinsulated from the second main fan-out wires 121 and the secondsub-fan-out wires 122 by the third insulating layer IL3 and the fourthinsulating layer IL4. Ends of the bending fan-out wire 141 may beconnected to the second main fan-out wires 121, respectively, through acontact hole passing through the third insulating layer IL3 and thefourth insulating layer IL4 and exposing ends of the second main fan-outwire 121. Other ends of the bending fan-out wires 141 may be connectedto the second sub-fan-out wires 122, respectively, through a contacthole passing through the third insulating layer IL3 and the fourthinsulating layer IL4 and exposing ends of the second sub-fan-out wire122.

The signal wires DL, the connection wires DM, and the fan-out wires Fare not limited to the embodiments shown in FIGS. 7 to 15, and theconductive layers constituting or including the wires may be variouslymodified.

Referring to FIG. 12, the display device 1 may include the substrate101, a buffer layer BF, a semiconductor layer ACT, a first insulatinglayer ILL the first conductive layer 110, the second insulating layerIL2, the second conductive layer 120, the third insulating layer IL3,the third conductive layer 130, the fourth insulating layer IL4, thefourth conductive layer 140, a fifth insulating layer IL5, a firstelectrode layer 171, the pixel definition film 160 including an openingexposing the first electrode layer 171, a light-emitting layer 172disposed in the opening of the pixel definition film 160, a secondelectrode layer 173 disposed on the light-emitting layer 172 and thepixel definition film 160, and a passivation layer 170.

Each of the above-described layers may be formed as a single film butmay also be formed as a stacked film including a plurality of films.Other layers may be further disposed between the above-described layers.

The substrate 101 may support each of the layers disposed thereon. Thesubstrate 101 may be made of an insulating material. The substrate 101may be made of an inorganic material, such as glass or quartz, or anorganic material such as polyimide. The substrate 101 may be a rigidsubstrate or a flexible substrate.

The buffer layer BF may be disposed on the substrate 101. The bufferlayer BF may prevent diffusion of impurity ions, prevent permeation ofmoisture, and perform a surface planarization function. The buffer layerBF may include silicon nitride, silicon oxide, silicon oxynitride, orthe like.

The semiconductor layer ACT may be disposed on the buffer layer BF. Thesemiconductor layer ACT constitutes channels of transistors of thepixels PX. The semiconductor layer ACT may include polycrystallinesilicon. Polycrystalline silicon may be formed by crystallizingamorphous silicon.

When the semiconductor layer ACT is made of polycrystalline silicon andis doped with ions, the ion-doped semiconductor layer ACT may haveconductivity. As a result, the semiconductor layer ACT may include notonly channel areas of the transistors but also source areas and drainareas. A source area and a drain area may be connected to sides of eachchannel area.

In another embodiment, the semiconductor layer ACT may include singlecrystalline silicon, low temperature polycrystalline silicon, amorphoussilicon, or an oxide semiconductor. For example, the oxide semiconductormay include a binary compound (AB_(x)), a ternary compound(AB_(x)C_(y)), or a quaternary compound (AB_(x)C_(y)D_(z)), whichincludes indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf),zirconium (Zr), magnesium (Mg), or the like. In an embodiment, thesemiconductor layer ACT may include ITZO (an oxide including indium,tin, and titanium) or IGZO (an oxide including indium, gallium, andtin).

The first insulating layer IL1 may be disposed on the semiconductorlayer ACT. The first insulating layer IL1 may be disposed on a surface(or substantially entire surface) of the substrate 101. The firstinsulating layer IL1 may be a gate insulating film having a gateinsulating function. The first insulating layer IL1 may include asilicon compound, a metal oxide, or the like. For example, the firstinsulating layer IL1 may include silicon oxide, silicon nitride, siliconoxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconiumoxide, titanium oxide, or the like. The first insulating layer IL1 maybe a single film or a multilayer film including stacked films made ofdifferent materials.

The first conductive layer 110 may be disposed on the first insulatinglayer ILL The first conductive layer 110 may include at least one metalselected from among molybdenum (Mo), aluminum (Al), platinum (Pt),palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni),neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium(Ti), tantalum (Ta), tungsten (W), and copper (Cu). The first conductivelayer 110 may be a single film or a multilayer film. The firstconductive layer 110 may include the first main fan-out wire 111 and thefirst sub-fan-out wire 112 of the above-described first fan-out wire F1,a gate electrode of a transistor, and a first electrode of a storagecapacitor.

The second insulating layer IL2 may be disposed on the first conductivelayer 110. The second insulating layer IL2 may be disposed on thesurface (or substantially entire) surface of the substrate 101. Thesecond insulating layer IL2 serves to insulate the first conductivelayer 110 from the second conductive layer 120.

The second insulating layer IL2 may be an interlayer insulating film.The second insulating layer IL2 may include the same material as thefirst insulating layer ILL The second insulating layer IL2 may includeat least one material selected from among the materials described as thestructural materials of the first insulating layer IL1.

The second conductive layer 120 may be disposed on the second insulatinglayer IL2. The second conductive layer 120 may include a secondelectrode of the storage capacitor. The second conductive layer 120 mayform the storage capacitor by overlapping the first conductive layer 110with the second insulating layer IL2 interposed therebetween. The secondconductive layer 120 may include at least one metal selected from amongmolybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver(Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium(Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta),tungsten (W), and copper (Cu). The second conductive layer 120 mayinclude the same material as the first conductive layer 110. But, thedisclosure is not limited thereto. The second conductive layer 120 maybe a single film or a multilayer film. The second conductive layer 120may include the second main fan-out wires 121 and the second sub-fan-outwires 122 of the second fan-out wires F2.

The third insulating layer IL3 may cover the second conductive layer120. The third insulating layer IL3 may insulate the second conductivelayer 120 from the third conductive layer 130. The third insulatinglayer IL3 may include the same material as the first insulating layerILL The third insulating layer IL3 may include at least one materialselected from among the materials described as the structural materialsof the first insulating layer IL1.

The third conductive layer 130 may be disposed on the third insulatinglayer IL3. The third conductive layer 130 may include at least one metalselected from aluminum (Al), molybdenum (Mo), platinum (Pt), palladium(Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium(Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum(Ta), tungsten (W), and copper (Cu). The third conductive layer 130 maybe a single film or a multilayer film. For example, the third conductivelayer 130 may have a stacked structure of Ti/Al/Ti, Mo/Al/Mo,Mo/AlGe/Mo, Ti/Cu, or the like. As shown in FIG. 12, for example, thethird conductive layer 130 may include a signal wire DL, a sourceelectrode SE, and a drain electrode DE. The source electrode SE and thedrain electrode DE may be respectively connected to the source area andthe drain area of the semiconductor layer ACT through contact holespassing through the third insulating layer IL3, the second insulatinglayer IL2, and the first insulating layer IL1.

The fourth insulating layer IL4 may cover the third conductive layer130. The fourth insulating layer IL4 may be a via layer. The fourthinsulating layer IL4 may include an organic insulating material such asa polyacrylate-based resin, epoxy resin, phenolic resin, apolyamide-based resin, a polyimide-based resin, a unsaturatedpolyester-based resin, a polyphenylenether-based resin, a polyphenylenesulfide-based resin, or benzocyclobutene (BCB).

The fourth conductive layer 140 may be disposed on the fourth insulatinglayer IL4. The fourth conductive layer 140 may include the same materialas the third conductive layer 130. The fourth conductive layer 140 mayinclude at least one material selected from among the materialsdescribed as the structural materials of the third conductive layer 130.The fourth conductive layer 140 may include the above-describedconnection wire DM and bending fan-out wire 141.

The fifth insulating layer IL5 may be disposed on the fourth conductivelayer 140. The fifth insulating layer IL5 may be a via layer. The fifthinsulating layer IL5 may include the same material as the fourthinsulating layer IL4. The fifth insulating layer IL5 may include atleast one material selected from among the materials described as thestructural materials of the fourth insulating layer IL4.

The first electrode layer 171 may be disposed on the fifth insulatinglayer IL5. The first electrode layer 171 may have a stacked filmstructure formed by stacking a material layer having a high workfunction and a reflective material layer. The material layer having thehigh work function may be made of or include at least one selected fromamong indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO),and indium oxide (In2O3). The reflective material layer may be made ofor include one selected from among silver (Ag), magnesium (Mg), aluminum(Al), platinum (Pt), lead (Pb), gold (Au), nickel (Ni), neodymium (Nd),iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), and mixturesthereof. The material layer having the high work function may bedisposed on the reflective material layer and may be disposed close tothe light-emitting layer 172. The first electrode layer 171 may have amultilayer structure of ITO/Mg, ITO/MgF, ITO/Ag, or ITO/Ag/ITO, but theembodiments are not limited thereto. An anode electrode of the pixelsmay be formed of the first electrode layer 171. The anode electrode maybe connected to the drain electrode DE through a contact hole passingthrough the fourth insulating layer IL4.

The pixel definition film 160 may be disposed on the first electrodelayer 171. The pixel definition film 160 may include an inorganicinsulating material such as silicon oxide, silicon nitride, siliconoxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalumoxide, or zinc oxide, or an organic insulating material such as apolyacrylate-based resin, epoxy resin, phenolic resin, a polyamide-basedresin, polyimide-based resin, a unsaturated polyester-based resin, apolyphenylenether-based resin, a polyphenylene sulfide-based resin, orBCB. The pixel definition film 160 may be a single film or a multilayerfilm including stacked films made of different materials.

The pixel definition film 160 may include the opening that exposes thefirst electrode layer 171. The opening may define a light-emitting areaof each of the subpixels R, G1, G2, and B.

The light-emitting layer 172 may be disposed in the opening of the pixeldefinition film 160. The light-emitting layer 172 may include an organiclight-emitting layer, a hole injecting/transporting layer, and anelectron injecting/transporting layer.

The second electrode layer 173 may be disposed on the light-emittinglayer 172 and the pixel definition film 160. A cathode electrode may beformed of the second electrode layer 173. The cathode electrode may bedisposed in the display area DA. In an embodiment, the cathode electrodemay be disposed in the entire (or substantially entire) display area DA.The second electrode layer 173 may include a material layer having a lowwork function, which is made of or include one selected from among Li,Ca, LiF/Ca, LiF/Al, Al, Mg, Ag, Pt, Pd, Ni, Au, Nd, Ir, Cr, BaF, Ba, anda compound or mixture thereof. The second electrode layer 173 mayfurther include a transparent metal oxide layer disposed on the materiallayer having the low work function.

The passivation layer 170 may be disposed on the second electrode layer173. The passivation layer 170 may prevent moisture or oxygen frompermeating into the light-emitting layer 172. The passivation layer 170may include at least one inorganic film and/or organic film. Theinorganic film may include, for example, at least one inorganic materialselected from among Al_(x)O_(y), TiO_(x), ZrO_(x), SiO_(x),AlO_(x)N_(y), Al_(x)N_(y), SiO_(x)N_(y), Si_(x)N_(y), ZnO_(x), andTa_(x)O_(y). For example, the organic layer may be formed bypolymerizing at least one monomer selected from the group consisting ofpentabromophenyl acrylate, 2-(9H-carbazol-9-yl)ethyl methacrylate,N-vinylcarbazole, bis(methacryloylthiophenyl)sulfide, and zirconiumacrylate. The organic film may be a planarization film.

The touch sensing layer TSL may be disposed on the passivation layer170.

The touch sensing layer TSL may include a first touch insulating layerTILL the first touch conductive layer 151, the second touch insulatinglayer TIL2, the second touch conductive layer 152, and a touchprotective layer 180.

Each of the above-described layers may be formed as a single film butmay also be formed as a stacked film including a plurality of films.Other layers may be further disposed between the above-described layers.

The first touch insulating layer TIL1 may include an organic film and/oran inorganic film. For example, the organic film may include at leastone selected from among an acrylic-based resin, a methacryl-based resin,polyisoprene, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, and a perylene-basedresin. For example, the inorganic film may include at least one selectedfrom among aluminum oxide, titanium oxide, silicon oxide, siliconoxynitride, zirconium oxide, and hafnium oxide.

The first touch conductive layer 151 may be disposed on the first touchinsulating layer TILL The first touch conductive layer 151 may includeat least one selected from among molybdenum, titanium, copper, aluminum,and an alloy thereof. The first touch conductive layer 151 may includethe connection electrodes BE. As described above, the first touchconductive layer 151 constituting or including the connection electrodesBE may have a mesh shape. The first touch conductive layer 151 may notbe visible to a user. In order to prevent a reduction in aperture ratioof the pixel PX, the connection electrodes BE may be disposed to overlapthe pixel definition film 160.

The second touch insulating layer TIL2 may be disposed on the firsttouch conductive layer 151. The second touch insulating layer TIL2 mayinsulate the first touch conductive layer 151 from the second touchconductive layer 152. The second touch insulating layer TIL2 may includethe same material as the first touch insulating layer TILL The secondtouch insulating layer TIL2 may include at least one material selectedfrom among the materials described as the structural materials of thefirst touch insulating layer TIL1.

The second touch conductive layer 152 may be disposed on the secondtouch insulating layer TIL2. The second touch conductive layer 152 mayinclude the same material as the first touch conductive layer 151. Thesecond touch conductive layer 152 may include at least one materialselected from among the materials described as the structural materialsof the first touch conductive layer 151. The second touch conductivelayer 152 may include the above-described first touch electrodes TE andsecond touch electrodes RE. As described above, the second touchconductive layer 152 constituting or including the first touchelectrodes TE and the second touch electrodes RE may have a mesh shape.The second touch conductive layer 152 may not be visible to a user. Inorder to prevent a reduction in aperture ratio of the pixel PX, thefirst touch electrodes TE and the second touch electrodes RE may bedisposed to overlap the pixel definition film 160.

The touch protective layer 180 may be disposed on the second touchconductive layer 152. The touch protective layer 180 may include thesame material as the first touch insulating layer TILL The touchprotective layer 180 may include at least one material selected fromamong the materials described as the structural materials of the firsttouch insulating layer TIL1.

In the following embodiments, the same components as the above-describedcomponents will be denoted by the same reference numerals, andrepetitive descriptions thereof will be omitted or simplified.

FIG. 16 is a plan view illustrating a display device 1_1 according toanother embodiment. FIG. 17 is an enlarged view illustrating area E ofFIG. 16. FIG. 18 is a schematic cross-sectional view taken along lineXVIII-XVIII′ of FIG. 17.

Referring to FIGS. 16 to 18, the embodiment is different from theembodiment of FIGS. 1 to 15. In the display device 1_1, anode electrodesANO1, ANO21, ANO22, and ANO3 of subpixels R, G1, G2, and B may overlapgaps G between protrusion patterns PP1 and PP2.

The anode electrodes ANO1, ANO21, ANO22, and ANO3 may include a firstanode electrode ANO1, second anode electrodes ANO21 and ANO22, and athird anode electrode ANO3.

The first anode electrode ANO1 may be disposed corresponding to a firstsubpixel R, the second anode electrodes ANO21 and ANO22 may be disposedcorresponding to second subpixels G1 and G2, and the third anodeelectrode ANO3 may be disposed corresponding to a third subpixel B. Thesecond anode electrodes ANO21 and ANO22 may include a second-A anodeelectrode ANO21 corresponding to a second-A subpixel G1 and a second-Banode electrode ANO22 corresponding to a second-B subpixel G2. Each ofthe anode electrodes ANO1, ANO21, ANO22, and ANO3 may be implementedwith the first electrode layer 171. The first electrode layer 171 mayinclude the anode electrodes ANO1, ANO21, ANO22, and ANO3.

Each of the anode electrodes ANO1, ANO21, ANO22, and ANO3 may include aprotrusion AP.

The protrusion AP of the first anode electrode ANO1 may protrude fromthe first anode electrode ANO1 in the first direction DR1, theprotrusions AP of the second anode electrodes ANO21 and ANO22 mayprotrude from the second anode electrodes ANO21 and ANO22 in the seconddirection DR2, and the protrusion AP of the third anode electrode ANO3may protrude from the third anode electrode ANO3 in the first directionDR1.

The protrusions AP of the anode electrodes ANO1, ANO21, ANO22, and ANO3may overlap the gaps G between the protrusion patterns PP1 and PP2. Thegaps G between the protrusion patterns PP1 and PP2 may overlap the touchelectrodes TSP as well as the protrusions AP of the anode electrodesANO1, ANO21, ANO22, and ANO3. The gaps G formed in a display area DA maybe blocked twice by the protrusions AP of the anode electrodes ANO1,ANO21, ANO22, and ANO3 and the touch electrodes TSP, thereby moreeffectively preventing a phenomenon such as reflection of external lightfrom the gaps G and/or visibility of a spot.

The positions and directions in which the protrusions AP of the anodeelectrodes ANO1, ANO21, ANO22, and ANO3 protrude are not limited to theembodiment shown in FIG. 17. The positions and directions in which theprotrusions AP protrude may be variously modified as long as the anodeelectrodes ANO1, ANO21, ANO22, and ANO3 may overlap the gaps G betweenthe protrusion patterns PP1 and PP2.

FIG. 19 is a plan view illustrating signal wires DL, connection wiresDM, and fan-out wires F of a display device 1_2 according to anotherembodiment. FIG. 20 is an enlarged view illustrating area F of FIG. 19.FIG. 21 is an enlarged view illustrating area F of FIG. 19 in which atouch sensing layer is applied. FIG. 22 is a schematic cross-sectionalview taken along line XXII-XXII′ of FIG. 21.

Referring to FIGS. 19 to 22, the embodiment is different from theembodiment of FIGS. 1 to 15. The display device 1_2 may further includedummy patterns DP.

The dummy patterns DP may be disposed in a display area DA and may bespaced apart from the connection wires DM. The dummy patterns DP may bedisposed around the connection wires DM to have a grid pattern shapetogether with the connection wires DM.

The dummy patterns DP may be partially bent and include a diagonalportion DPB extending in a diagonal direction. The diagonal portion DPBmay be a portion in which a dummy pattern DP is bent in a first diagonaldirection DR4 or a second diagonal direction DR5.

As shown in FIG. 20, the diagonal portion DPB may have a shape which isbent in the first diagonal direction DR4 and/or the second diagonaldirection DR5 from an end of a dummy pattern DP which extends in thefirst direction DR1.

The diagonal portion DPB may have a shape protruding from a side of thedummy pattern DP. For example, as shown in FIG. 20, the diagonal portionDPB may protrude from a side of the dummy pattern DP in a directionopposite to the first diagonal direction DR4.

The dummy pattern DP may include dummy protrusion patterns DPP1 and DPP2protruding from a side of the dummy pattern DP. The dummy protrusionpatterns DPP1 and DPP2 may include first dummy protrusion patterns DPP1protruding from the diagonal portion DPB and second dummy protrusionpatterns DPP2 protruding from an extension portion of the respectivedummy patterns DP. The extension portion may include portions of a dummypattern DP excluding the diagonal portion DPB. For example, theextension portion of a dummy pattern DP may be any portion of the dummypattern DP excluding the diagonal portion DPB.

Each of the first dummy protrusion patterns DPP1 may have a shapeprotruding from a side of the diagonal portion DPB. The first dummyprotrusion patterns DPP1 may protrude in a direction opposite to thefirst direction DR1.

Each of the second dummy protrusion patterns DPP2 may have a shapeprotruding from the extension portion of the dummy pattern DP. Thesecond dummy protrusion patterns DPP2 may protrude in a directionopposite to the first direction DR1.

Parts (or end parts) of the dummy protrusion patterns DPP1 and DPP2 ofthe dummy pattern DP and the parts (or end parts) of the protrusionpatterns PP1 and PP2 of the connection wire DM may be adjacent to eachother and may face each other. The parts of the dummy protrusionpatterns DPP1 and DPP2 and the parts of the protrusion patterns PP1 andPP2 which are adjacent each other may overlap the touch electrodes TSP.

Gaps G may be defined between the parts (or end parts) of the dummyprotrusion patterns DPP1 and DPP2 and the parts (or end parts) of theprotrusion patterns PP1 and PP2, which are adjacent to each other. Thegaps G between the adjacent parts of the dummy protrusion patterns DPP1and DPP2 and the protrusion patterns PP1 and PP2 may overlap the touchelectrodes TSP. The gaps G may overlap first touch electrodes TE, secondtouch electrode RE, or connection electrodes BE.

A width of the gaps G between the dummy protrusion patterns DPP1 andDPP2 and the protrusion patterns PP1 or PP2 may be smaller than a linewidth of the touch electrodes TSP. The width of the gaps G may besmaller than a line width of the dummy patterns DP. The width of thegaps G may be a distance between the parts (or end parts) of the dummyprotrusion patterns DPP1 and DPP2 and the parts (or end parts) of theprotrusion patterns PP1 or PP2, which face each other.

The width of the gaps G may be in a range of about 2.0 μm to about 3.0μm. The line width of the touch electrode TSP may be in a range of about3.2 μm to about 4.8 μm. However, the disclosure is not limited thereto.In other embodiments, for example, the line width of the touchelectrodes TSP may be in a range of about 4.8 μm to about 7.2 μm. Anarea in which the touch electrodes TSP overlap the gaps G may beincreased, thereby more effectively preventing a phenomenon such asreflection of external light from the gaps G and/or visibility of aspot. The line width of the dummy patterns DP may be in a range of about2.4 μm to about 3.6 μm. However, the width of the gaps G and the linewidth of the wires are not limited thereto, and the range thereof is notlimited thereto as long as the gaps G between the dummy protrusionpatterns DPP1 and DPP2 and the protrusion patterns PP1 and PP2 overlapthe touch electrodes TSP. Since the gaps G between the dummy protrusionpatterns DPP1 and DPP2 and the protrusion patterns PP1 and PP2 overlapthe touch electrodes TSP, the gaps G formed in the display area DA maybe blocked by the touch electrodes TSP. Therefore, it is possible toprevent a phenomenon such as reflection of external light from the gapsG and/or visibility of a spot.

The first dummy protrusion patterns DPP1 and the second dummy protrusionpatterns DPP2 may be alternately disposed in the second direction DR2.The first dummy protrusion patterns DPP1 may be disposed between thesecond dummy protrusion patterns DPP2.

The first dummy protrusion patterns DPP1 and/or the second dummyprotrusion patterns DPP2 may be disposed at an interval in the seconddirection DR2. For example, an interval between the dummy protrusionpatterns DPP1 and DPP2 disposed in the second direction DR2 may besubstantially the same as an interval between the connection wires DMdisposed in the second direction DR2.

The dummy patterns DP and the connection wires DM may be disposed to becoplanar. For example, as shown in FIG. 22, the dummy patterns DP may beimplemented with a fourth conductive layer 140. The fourth conductivelayer 140 may include the dummy patterns DP. However, the disclosure isnot limited thereto. In other embodiments, the dummy patterns DP may beimplemented with a different conductive layer from the connection wireDM.

In the display device 1_2 including the dummy patterns DP, the dummypatterns DP may have a grid pattern shape in the display area DAtogether with the connection wires DM. Accordingly, an anomalous patternaround the connection wires DM may be minimized to prevent a phenomenonin which the connection wire DM is visible.

FIG. 23 is a perspective view illustrating a display device according toanother embodiment. FIG. 24 is a plan view illustrating the displaydevice 1_3 of FIG. 23. FIG. 25 is a plan view illustrating signal wiresDL, connection wires DM, and fan-out wires F of the display device 1_3of FIG. 23.

Referring to FIGS. 23 to 25, the embodiment is different from theembodiment of FIGS. 1 to 15. In the display device 1_3, a main area MRof a display panel 10_1 may include a front display area DA0, sidedisplay areas DA1, DA2, DA3, and DA4, and corner areas C1, C2, C3, andC4.

The front display area DA0 and the side display areas DA1, DA2, DA3, andDA4 may be display areas DA in which images may be displayed. The cornerareas C1, C2, C3, and C4 are non-display areas NDA in which no image isdisplayed. The corner areas C1, C2, C3, and C4 may provide spacesthrough which signal wires DL and connection wires DM may pass.

The front display area DA0 may have a rectangular shape which includestwo long sides extending in a first direction DR1 and two short sidesextending in a second direction DR2. However, the embodiments are notlimited thereto. In other embodiments, a corner at which the short sideand the long side meet may have a rounded polygonal shape.

The side display areas DA1, DA2, DA3, and DA4 may include a first sidedisplay area DA1, a second side display area DA2, a third side displayarea DA3, and a fourth side display area DA4.

The first side display area DA1 may be an area extending from an edge ofthe front display area DA0 in a direction opposite to the firstdirection DR1. The second side display area DA2 may be an area extendingfrom the edge of the front display area DA0 in a direction opposite tothe second direction DR2. The third side display area DA3 may be an areaextending from the edge of the front display area DA0 in the firstdirection DR1. The fourth side display area DA4 may be an area extendingfrom the edge of the front display area DA0 in the second direction DR2.

The first, second, third, and fourth side display areas DA1, DA2, DA3,and DA4 may be structured or configured in a similar manner, except forpositions thereof. Hereinafter, common features of the first, second,third, and fourth side display areas DA1, DA2, DA3, and DA4 will bedescribed based on the first side display area DA1, and repetitivedescriptions thereof will be omitted.

The first side display area DA1 may extend outward from the edge of thefront display area DA0 and may be bent at a predetermined or selectedangle. For example, the first side display area DA1 may be bent at anangle in a range from about 90° to about 150° with respect to the frontdisplay area DA0.

The first side display area DA1 may be connected to a bent area BR. Asshown in FIG. 23 and FIG. 24, when the first side display area DA1 isbent (for example, at a right angle) with respect to the front displayarea DA0, the bent area BR may be bent (for example, at a right angle)once more with respect to the first side display area DA1. The bent areaBR may be bent (for example, at an angle of about 180°) with respect tothe front display area DA0. Accordingly, a sub-area SR disposed at aside of the bent area BR may be disposed below the front display areaDA0 in a thickness direction of the front display area DA0. The sub-areaSR may overlap the front display area DA0 and may be disposedsubstantially parallel to the front display area DA0.

The corner areas C1, C2, C3, and C4 may be disposed or positionedbetween the side display areas DA1, DA2, DA3, and DA4. The corner areasC1, C2, C3, and C4 may include first, second, third, and fourth cornerareas C1, C2, C3, and C4 disposed or positioned between the first,second, third, and fourth side display areas DA1, DA2, DA3, and DA4. Thefirst, second, third, and fourth corner areas C1, C2, C3, and C4 may bedisposed adjacent to four corners at which the long sides and the shortsides of the front display area DA0 meet. The first, second, third, andfourth corner areas C1, C2, C3, and C4 may be structured or configuredin a similar manner, except for positions thereof. Hereinafter, commonfeatures of the first, second, third, and fourth corner areas C1, C2,C3, and C4 will be described based on the first corner area C1, andrepetitive descriptions thereof will be omitted.

The first corner area C1 may be disposed or positioned between the firstside display area DA1 and the second side display area DA2. An end ofthe first corner area C1 may be in contact with the first side displayarea DA1, and another end of the first corner area C1 may be in contactwith the second side display area DA2.

The first corner area C1 may extend from the front display area DA0 andmay be roundly formed to have a curvature. A curvature of the firstcorner area C1 with respect to the front display area DA0 may be greaterthan a curvature of the first side display area DA1 and the second sidedisplay area DA2 with respect to the front display area DA0.

The first corner area C1 may provide a space in which the signal wiresDL may be connected to the connection wires DM.

The signal wires DL may extend from the first corner area C1 and may bedisposed in the side display areas DA1, DA2, DA3, and DA4 and the frontdisplay area DA0. The signal wires DL may extend from the non-displayarea NDA between the first side display area DA1 and the bent area BRand may be disposed in the side display areas DA1, DA2, DA3, and DA4 andthe front display area DA0.

The connection wires DM may extend from the non-display area NDA betweenthe first side display area DA1 and the bent area BR and extend to thefirst corner area C1 via the first side display area DA1, the frontdisplay area DA0, or the second side display area DA2.

The connection wires DM may be electrically connected to the signalwires DL in the first corner area C1. The connection wires DM may beelectrically connected to the signal wires DL in the non-display areaNDA between the first side display area DA1 and the bent area BR.

The display device 1_3 may include the connection wires DM disposedthrough the display area DA, and image signals may be provided to thesignal wires DL through the connection wires DM. Therefore, noadditional dead space is required for connecting the signal wires DL tothe fan-out wires F.

The fan-out wires F may extend from a driving chip 20 of the sub-area SRto the non-display area NDA of the main area MR.

The fan-out wires F may be electrically connected to the signal wiresDL. Some of the fan-out wires F may be connected (or directly connected)to some of the signal wires DL, and the rest of the fan-out wires F maybe connected (or directly connected) to the connection wires DM andconnected to the signal wires DL by the connection wires DM.

Since the signal wires DL, the connection wires DM, and the fan-outwires F are described above with reference to FIGS. 1 to 15, repetitivedescriptions thereof are omitted.

In the above described embodiments, a dead space of a display device canbe reduced or minimized as the connection wires are arranged in adisplay area as described above.

The gaps between the wires can be blocked by the touch electrodes of thetouch sensing layer, thereby preventing a phenomenon such as reflectionof external light from the gaps and/or visibility of a spot. As aresult, display quality can be improved.

Effects of the disclosure are not restricted to the embodiments setforth herein. In concluding the detailed description, those skilled inthe art will appreciate that many variations and modifications may bemade to the embodiments without substantially departing from theprinciples and spirit and scope of the. Therefore, the disclosedembodiments are used in a generic and descriptive sense only and not forpurposes of limitation.

What is claimed is:
 1. A display device comprising: a display panelcomprising a display area and a non-display area; signal wires disposedin the display area; connection wires disposed in the display area andelectrically connected to the signal wires; and touch electrodesdisposed on the connection wires, wherein the connection wires comprise:diagonal portions extending in a diagonal direction; and firstprotrusion patterns protruding from the diagonal portions of theconnection wires, wherein parts of the first protrusion patterns overlapthe touch electrodes.
 2. The display device of claim 1, wherein adjacentones of the parts of the first protrusion patterns face each other, anda gap between the adjacent ones of the parts of the first protrusionpatterns overlaps the touch electrodes.
 3. The display device of claim2, wherein a distance between the adjacent ones of the parts of thefirst protrusion patterns is smaller than a line width of the touchelectrodes.
 4. The display device of claim 1, wherein the signal wiresextend in a first direction, and the first protrusion patterns protrudein the first direction or a second direction intersecting the firstdirection.
 5. The display device of claim 4, wherein the connectionwires further comprise second protrusion patterns protruding from anextension portion of the connection wires, wherein the extension portionincludes portions of the connection wires excluding the diagonalportions, and parts of the second protrusion patterns overlap the touchelectrodes.
 6. The display device of claim 5, wherein adjacent ones ofthe parts of the second protrusion patterns face each other, and a gapbetween the adjacent ones of the parts of the second protrusion patternsoverlaps the touch electrodes.
 7. The display device of claim 5, whereina part of at least one of the first protrusion patterns and a part of atleast one of the second protrusion patterns are adjacent to each other,and a gap between the part of the at least one of the first protrusionpatterns and the part of the at least one of the second protrusionpatterns overlaps the touch electrodes.
 8. The display device of claim5, wherein the first protrusion patterns and the second protrusionpatterns are alternately disposed in the second direction, and aninterval between the first protrusion patterns or between the secondprotrusion patterns is substantially same as an interval between theconnection wires disposed in the second direction.
 9. The display deviceof claim 5, wherein a length of the first protrusion patterns in thefirst direction is different from a length of the second protrusionpatterns in the first direction.
 10. The display device of claim 1,wherein the connection wires comprise: a first portion extending fromthe non-display area in a first direction; a second portion extendingfrom an end of the first portion in a second direction intersecting thefirst direction; and a third portion extending from an end of the secondportion in a direction opposite to the first direction.
 11. The displaydevice of claim 10, wherein the display device comprises: a firstconductive layer including the signal wires; a second conductive layerdisposed on the first conductive layer and including the connectionwires; and an insulating layer disposed between the first conductivelayer and the second conductive layer, wherein the connection wires arein contact with the signal wires through a contact hole passing throughthe insulating layer.
 12. The display device of claim 11, furthercomprising: a first electrode layer disposed on the second conductivelayer; a second electrode layer disposed on the first electrode layer;and a light-emitting layer disposed between the first electrode layerand the second electrode layer.
 13. The display device of claim 10,wherein the first portion is electrically connected to the signal wires,and the third portion is spaced apart from the first portion.
 14. Thedisplay device of claim 1, further comprising dummy patterns disposed ata side of the connection wires in the display area, wherein the dummypatterns include diagonal portions extending in a diagonal direction.15. The display device of claim 14, further comprising first dummyprotrusion patterns protruding from the diagonal portions of the dummypatterns, wherein a part of at least one of the first dummy protrusionpatterns and a part of at least one of the first protrusion patterns areadjacent to each other.
 16. The display device of claim 15, wherein agap between the part of the at least one of the first dummy protrusionpatterns and the part of the at least one of the first protrusionpatterns overlaps the touch electrodes.
 17. The display device of claim15, wherein a distance between the part of the at least one of the firstdummy protrusion patterns and the part of the at least one of the firstprotrusion patterns is smaller than a line width of the touchelectrodes.
 18. The display device of claim 14, wherein the dummypatterns and the connection wires are disposed on a same conductivelayer.
 19. The display device of claim 1, wherein the touch electrodesare disposed in the display area and further comprise: first touchelectrodes disposed in a first direction; and connection electrodes thatelectrically connect the first touch electrodes.
 20. The display deviceof claim 19, wherein the touch electrodes further comprise second touchelectrodes disposed in a second direction intersecting the firstdirection, wherein the first touch electrodes and the second touchelectrodes are spaced apart from each other.
 21. The display device ofclaim 1, further comprising: pixels disposed in the display area; and apixel definition film that defines light-emitting areas of the pixels,wherein the touch electrodes overlap the pixel definition film.